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概要

The IEEE VLSI Test Symposium (VTS) explores emerging trends and novel concepts in test, validation, yield, reliability, and security of microelectronic circuits and systems. The symposium will take place on April 27-29 2026, in Napa, CA, USA. The program includes keynotes, scientific paper presentations, late breaking result papers, short industrial application paper presentations, special sessions, and Innovative Practices sessions. The areas of interest include (but are not limited to) the following topics: Generative AI Applications in Test and Security, Silicon Lifecycle Management, Silent Data Corruption, Test-Enabled Digital Twin, Analog – Mixed-Signal – RF Test, ATPG and Compression, Automotive Test and Safety, Built-In Self-Test (BIST), Functional safety, Digital twin-enabled test and security, High BW Test through High-Speed Interfaces, Testing for extreme environments, Test og Non-Si and Compound Circuits, Test and Security of Quantum Circuits, Test and Security of Photonic Circuits, Test and Security of Emerging Memory Technologies, Functional Debug through Scan, Fault Modeling and Simulation, Low-Power IC Test, Machine Learning for Test and Security, Microsystems/MEMS/Sensors Test, Memory Test and Repair, Test for 3D and Heterogenous Integration, Yield Optimization, Online Test and Error Correction, Power and Thermal Issues in Test, System-on-Chip (SOC) Test, Test and Reliability of Biomedical Devices, Test and Reliability of High-Speed I/O, Test and Security of Machine Learning Hardware, Test Standards, FPGA Test, Defect-Based Test, Defect and Fault Tolerance, Delay and Performance Test, Design for Testability, Post-silicon Validation and Debug, Hardware Security, Embedded System and Board Test.

論文募集

The IEEE VLSI Test Symposium (VTS) explores emerging trends and novel concepts in test, validation, yield, reliability, and security of microelectronic circuits and systems. The symposium will take place on April 27-29 2026, in Napa, CA, USA. The program includes keynotes, scientific paper presentations, late breaking result papers, short industrial application paper presentations, special sessions, and Innovative Practices sessions. The areas of interest include (but are not limited to) the following topics: Generative AI Applications in Test and Security, Silicon Lifecycle Management, Silent Data Corruption, Test-Enabled Digital Twin, Analog – Mixed-Signal – RF Test, ATPG and Compression, Automotive Test and Safety, Built-In Self-Test (BIST), Functional safety, Digital twin-enabled test and security, High BW Test through High-Speed Interfaces, Testing for extreme environments, Test og Non-Si and Compound Circuits, Test and Security of Quantum Circuits, Test and Security of Photonic Circuits, Test and Security of Emerging Memory Technologies, Functional Debug through Scan, Fault Modeling and Simulation, Low-Power IC Test, Machine Learning for Test and Security, Microsystems/MEMS/Sensors Test, Memory Test and Repair, Test for 3D and Heterogenous Integration, Yield Optimization, Online Test and Error Correction, Power and Thermal Issues in Test, System-on-Chip (SOC) Test, Test and Reliability of Biomedical Devices, Test and Reliability of High-Speed I/O, Test and Security of Machine Learning Hardware, Test Standards, FPGA Test, Defect-Based Test, Defect and Fault Tolerance, Delay and Performance Test, Design for Testability, Post-silicon Validation and Debug, Hardware Security, Embedded System and Board Test.

重要な日付

カンファレンス日程

Conference Date

2026年4月27日

以前:
  • 2026年4月27日 - 2026年4月29日
  • 2025年4月28日 - 2025年4月30日

投稿

Paper submission

新規

2025年12月5日

通知

Notification date

新規

2026年1月31日

カメラレディ

Camera-ready

新規

2026年3月31日

その他の日付

Paper PDF upload

2024年12月2日

Special Session Proposals

2025年1月31日

情報源ランク

情報源: CORE2023

ランク: TBR

研究分野: Computer Systems Engineering

地図

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