
4月27日 - 2026年4月27日
IEEE VLSI Test Symposium
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概览
The IEEE VLSI Test Symposium (VTS) explores emerging trends and novel concepts in test, validation, yield, reliability, and security of microelectronic circuits and systems. The symposium will take place on April 27-29 2026, in Napa, CA, USA. The program includes keynotes, scientific paper presentations, late breaking result papers, short industrial application paper presentations, special sessions, and Innovative Practices sessions. The areas of interest include (but are not limited to) the following topics: Generative AI Applications in Test and Security, Silicon Lifecycle Management, Silent Data Corruption, Test-Enabled Digital Twin, Analog – Mixed-Signal – RF Test, ATPG and Compression, Automotive Test and Safety, Built-In Self-Test (BIST), Functional safety, Digital twin-enabled test and security, High BW Test through High-Speed Interfaces, Testing for extreme environments, Test og Non-Si and Compound Circuits, Test and Security of Quantum Circuits, Test and Security of Photonic Circuits, Test and Security of Emerging Memory Technologies, Functional Debug through Scan, Fault Modeling and Simulation, Low-Power IC Test, Machine Learning for Test and Security, Microsystems/MEMS/Sensors Test, Memory Test and Repair, Test for 3D and Heterogenous Integration, Yield Optimization, Online Test and Error Correction, Power and Thermal Issues in Test, System-on-Chip (SOC) Test, Test and Reliability of Biomedical Devices, Test and Reliability of High-Speed I/O, Test and Security of Machine Learning Hardware, Test Standards, FPGA Test, Defect-Based Test, Defect and Fault Tolerance, Delay and Performance Test, Design for Testability, Post-silicon Validation and Debug, Hardware Security, Embedded System and Board Test.
论文征集
The IEEE VLSI Test Symposium (VTS) explores emerging trends and novel concepts in test, validation, yield, reliability, and security of microelectronic circuits and systems. The symposium will take place on April 27-29 2026, in Napa, CA, USA. The program includes keynotes, scientific paper presentations, late breaking result papers, short industrial application paper presentations, special sessions, and Innovative Practices sessions. The areas of interest include (but are not limited to) the following topics: Generative AI Applications in Test and Security, Silicon Lifecycle Management, Silent Data Corruption, Test-Enabled Digital Twin, Analog – Mixed-Signal – RF Test, ATPG and Compression, Automotive Test and Safety, Built-In Self-Test (BIST), Functional safety, Digital twin-enabled test and security, High BW Test through High-Speed Interfaces, Testing for extreme environments, Test og Non-Si and Compound Circuits, Test and Security of Quantum Circuits, Test and Security of Photonic Circuits, Test and Security of Emerging Memory Technologies, Functional Debug through Scan, Fault Modeling and Simulation, Low-Power IC Test, Machine Learning for Test and Security, Microsystems/MEMS/Sensors Test, Memory Test and Repair, Test for 3D and Heterogenous Integration, Yield Optimization, Online Test and Error Correction, Power and Thermal Issues in Test, System-on-Chip (SOC) Test, Test and Reliability of Biomedical Devices, Test and Reliability of High-Speed I/O, Test and Security of Machine Learning Hardware, Test Standards, FPGA Test, Defect-Based Test, Defect and Fault Tolerance, Delay and Performance Test, Design for Testability, Post-silicon Validation and Debug, Hardware Security, Embedded System and Board Test.
会议日期
Conference Date
2026年4月27日
- 2026年4月27日 - 2026年4月29日
- 2025年4月28日 - 2025年4月30日
投稿
Paper submission
新2025年12月5日
通知
Notification date
新2026年1月31日
终稿
Camera-ready
新2026年3月31日
其他日期
Paper PDF upload
2024年12月2日
Special Session Proposals
2025年1月31日
来源排名
来源: CORE2023
排名: TBR
研究领域: Computer Systems Engineering